JPS6214040B2 - - Google Patents
Info
- Publication number
- JPS6214040B2 JPS6214040B2 JP54164111A JP16411179A JPS6214040B2 JP S6214040 B2 JPS6214040 B2 JP S6214040B2 JP 54164111 A JP54164111 A JP 54164111A JP 16411179 A JP16411179 A JP 16411179A JP S6214040 B2 JPS6214040 B2 JP S6214040B2
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- treatment
- peel strength
- rough surface
- chromate treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Electrochemical Coating By Surface Reaction (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16411179A JPS5687694A (en) | 1979-12-19 | 1979-12-19 | Manufacture of copper foil for printed circuit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16411179A JPS5687694A (en) | 1979-12-19 | 1979-12-19 | Manufacture of copper foil for printed circuit |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5687694A JPS5687694A (en) | 1981-07-16 |
JPS6214040B2 true JPS6214040B2 (en]) | 1987-03-31 |
Family
ID=15786955
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16411179A Granted JPS5687694A (en) | 1979-12-19 | 1979-12-19 | Manufacture of copper foil for printed circuit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5687694A (en]) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6441538U (en]) * | 1987-09-02 | 1989-03-13 | ||
JPH0386728U (en]) * | 1989-12-20 | 1991-09-03 | ||
JP5723770B2 (ja) * | 2009-06-05 | 2015-05-27 | Jx日鉱日石金属株式会社 | 半導体パッケージ基板用銅箔及び半導体パッケージ用基板 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5155655A (en) * | 1989-08-23 | 1992-10-13 | Zycon Corporation | Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture |
JP5306620B2 (ja) * | 2007-09-11 | 2013-10-02 | 古河電気工業株式会社 | 超音波溶接用銅箔、およびその表面処理方法 |
TWI627876B (zh) * | 2012-08-06 | 2018-06-21 | Jx Nippon Mining & Metals Corp | Metal foil with carrier |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5142575A (ja) * | 1974-10-08 | 1976-04-10 | Matsushita Electric Ind Co Ltd | Koondosensaa |
JPS5440058A (en) * | 1977-09-06 | 1979-03-28 | Toshiba Corp | Maintenance monitor system |
-
1979
- 1979-12-19 JP JP16411179A patent/JPS5687694A/ja active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6441538U (en]) * | 1987-09-02 | 1989-03-13 | ||
JPH0386728U (en]) * | 1989-12-20 | 1991-09-03 | ||
JP5723770B2 (ja) * | 2009-06-05 | 2015-05-27 | Jx日鉱日石金属株式会社 | 半導体パッケージ基板用銅箔及び半導体パッケージ用基板 |
Also Published As
Publication number | Publication date |
---|---|
JPS5687694A (en) | 1981-07-16 |
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